Cai Junxiang et al. have published one paper in IEEE JMEMS
J. Cai, Y. Wang and T. Wu, “High-Order Piezoelectric Micromachined Ultrasonic Transducer With Piezoelectric Layer Trench for Ultrasound Imaging,” in Journal of Microelectromechanical Systems, vol. 34, no. 4, pp. 359-361, Aug. 2025, doi: 10.1109/JMEMS.2025.3560146


